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Principal Packaging Engineer - Advanced Semiconductor Systems
Visa Sponsorship
Relocation
AI Summary
Seeking a Principal Packaging Engineer to architect advanced 2.5D/3D packaging and heterogeneous integration solutions for next-generation semiconductor systems. Responsibilities include leading chiplet development, defining roadmaps, and driving innovation from concept to qualification. Requires strong technical leadership and extensive experience in advanced semiconductor packaging.
Key Highlights
Architect advanced 2.5D/3D packaging and heterogeneous integration solutions.
Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development.
Define packaging technology roadmaps and drive long-term innovation.
Key Responsibilities
Architect advanced 2.5D/3D packaging and heterogeneous integration solutions.
Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development.
Take packaging concepts from customer requirements through prototyping, demonstrators and qualification.
Define packaging technology roadmaps and drive long-term innovation.
Lead multidisciplinary technical projects across design, assembly, thermal and test.
Develop advanced microelectronic modules and system demonstrators.
Provide technical leadership across design, validation and qualification.
Support hands-on prototyping and laboratory development.
Contribute to technical proposals, bids and collaborative R&D programmes.
Manage technical risks and support technology decisions with customers and partners.
Technical Skills Required
Benefits & Perks
Competitive salary + bonus
Sponsorship + Relocation assistance
Company pension
Private healthcare for you and your family
Hybrid working to fit around your schedule
A healthy work environment, with great work life balance
Nice to Have
Experience in AI, HPC, telecoms or photonics is desired but not a must.
Job Description
My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position.
Responsibilities
- Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
- Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
- Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
- Define packaging technology roadmaps and drive long-term innovation
- Lead multidisciplinary technical projects across design, assembly, thermal and test
- Develop advanced microelectronic modules and system demonstrators
- Provide technical leadership across design, validation and qualification
- Support hands-on prototyping and laboratory development
- Contribute to technical proposals, bids and collaborative R&D programmes
- Manage technical risks and support technology decisions with customers and partners
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- Strong experience in advanced semiconductor packaging and heterogeneous integration
- Expertise in 2.5D/3D packaging, chiplets and advanced assembly
- Experience with substrates, interposers, TSVs and/or hybrid bonding
- Proven experience leading semiconductor packaging development projects
- Understanding of the full packaging lifecycle from design through qualification
- Knowledge of signal integrity, power integrity and thermal management
- Experience taking R&D concepts through to working prototypes or demonstrators
- Strong technical leadership, problem-solving and communication skills
- Experience in AI, HPC, telecoms or photonics is desired but not a must
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- Competitive salary + bonus
- Sponsorship + Relocation assistance
- Company pension
- Private healthcare for you and your family
- Hybrid working to fit around your schedule
- A healthy work environment, with great work life balance
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